[News] Huawei Reportedly Establishing Extensive Chip Equipment R&D Center in Shanghai

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According to a report from Nikkei Asia, Chinese tech giant Huawei is building a semiconductor equipment research and development center in Shanghai to navigate U.S. export controls and strengthen its chip supply chain.

As per the same report from Nikkei Asia, Huawei is offering salaries double that of its competitors to recruit experienced talent. However, industry sources cited by the same report suggest that Huawei’s demanding work culture may make retaining talent challenging, despite the attractive pay.

The report further highlights the center’s crucial role in developing photolithography machines, essential for advanced chip production. U.S. export controls have made it difficult for Huawei to access such equipment, which is primarily manufactured by three global leaders: ASML from the Netherlands, Nikon, and Canon from Japan.

Sources cited in the report has revealed that Huawei’s new research center is located in the western Qingpu district of Shanghai, featuring spacious grounds housing the main chip development center and the new headquarters of HiSilicon, Huawei’s semiconductor design division.

The area also hosts wireless technology and smartphone development centers. As per the Qingpu District People’s Government in Shanghai, once completed, the park will accommodate over 35,000 high-tech workers.

To attract talent, Huawei reportedly offers salaries twice that of local chip manufacturers. Industry sources cited in the report further noted that Huawei has recruited engineers with experience collaborating with top global semiconductor equipment manufacturers like Applied Materials, Lam Research, KLA, and ASML. Engineers with over 15 years of experience at chip manufacturers such as TSMC, Intel, and Micron are also on Huawei’s potential recruitment list.

The export control measures implemented by the United States in recent years have made it more difficult for Chinese citizens to work for global chip companies in China. This has left Huawei and other Chinese semiconductor enterprises with a larger pool of top chip talent to choose from.

Regarding the matter, TrendForce has addressed the export restrictions on semiconductor equipment by the US and its allies present significant hurdles for Chinese foundries in obtaining essential tools. To counter these challenges, the Chinese government, alongside local suppliers, is intensifying R&D efforts to produce domestic semiconductor equipment, especially for 16/12nm processes and smaller.

This has led to increased collaboration between Chinese foundries and local suppliers in both R&D and qualification processes. Despite these efforts, China’s progress in lithography tools is limited to the 90nm node, which remains a significant obstacle in achieving complete self-sufficiency in semiconductor equipment.

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(Photo credit: Huawei)