In a bid to catch up with leading players like TSMC, the South Korean government is said to have approved a national-level initiative aimed at actively promoting the development of advanced chip packaging technologies, according to a report from South Korean media outlet TheElec.
Citing anonymous sources, the report on April 30th indicates that the feasibility of the aforementioned plan has passed the preliminary examination conducted by the Korea Institute of S&T Evaluation and Planning (KISTEP).
According to reports, the preliminary review targeted a national-level project with a value exceeding KRW 50 billion, with direct government sponsorship exceeding KRW 30 billion. Such projects rarely pass the review in one go, but the aforementioned chip packaging case is an exception.
Most of the reviewers at KISTEP have reportedly reached a consensus, recognizing the necessity of the project to catch up with leaders in advanced packaging like Taiwan’s TSMC, making South Korea a frontrunner.
As per TrendForce’s previous report, by 2027, Korea’s share in advanced process capacity is originally expected to reach 11.5%, with room for further growth.
However, the budget for the 7-year project has been reduced from the original KRW 500 billion to KRW 206.8 billion. After passing the preliminary feasibility review, the project is expected to be formally announced later this year (2024) and is scheduled to commence implementation next year.
Cited by the same report from TheElec, a source involved in the project stated that the budget cut was entirely expected, but the project’s single-pass approval is indeed noteworthy, indicating the government’s deep understanding of the importance of chip packaging.
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(Photo credit: TSMC)