[News] Indian Software Company to Make Inroads into Chip Manufacturing

---

---

According to a report from global media Reuters, the Indian software company Zoho plans to invest USD 700 million in the chip manufacturing sector.

Founded in 1996 and currently headquartered in Tamil Nadu, India, Zoho provides software and related services to businesses across 150 countries.

Zoho is considering the production of compound semiconductors and is seeking incentives from the Indian government. The proposal is currently being reviewed by the committee responsible for promoting India’s chip initiative under the Ministry of Electronics and Information Technology.

Compound semiconductors are semiconductor materials composed of two or more different elements. Compared to traditional silicon (Si) semiconductors, compound semiconductors generally boast higher electron mobility, wider bandgap, and better thermal stability and radiation resistance. These properties make them suitable for applications that require high speed, high frequency, high temperature, and high efficiency. Compound semiconductor materials abound, among which silicon carbide (SiC) and gallium nitride (GaN) are representatives. Currently, both materials are sought-after in consumer electronics and EV markets.

In recent years, India has actively promoted chip assembly and local production as a way of becoming a key player in global semiconductor market. The industry source points out that India’s chip initiative aims to strengthen the country’s position and competitiveness in global semiconductor industry through increased investment, international cooperation, infrastructure development, and talent cultivation.

In February 2024, India approved a semiconductor manufacturing investment plan totaling INR 1.26 trillion (USD 15.2 billion), covering wafer fabrication and chip packaging sectors, inclusive of India’s first fab, a collaboration between Tata Group and Powerchip.

The plant is expected to produce 50,000 wafers per month, covering multiple mature nodes including 28nm, 40nm, 55nm, 90nm, and 110nm. The goal is to produce 3 billion chips annually for various segments, such as high-power computing, EV, telecommunication, and power electronic.

Read more

• [News] 12-Inch Wafer Capacity Construction Going Full Steam
• [News] PSMC Collaborates with Tata to Establish India’s First Fab

(Photo credit: iStock)