Micron Technology Inc., the American memory giant, has slightly increased its capital expenditure for this year (2024) and has not updated its financial forecasts for the second quarter (March to May).
According to reports from Reuters, Investing.com, and other global news outlets, Matt Murphy, the CFO of Micron, stated on May 21st that the company’s capital expenditure forecast for 2024 is expected to reach approximately USD 8 billion, up from the previous estimate of USD 7.5 billion. This increase is primarily attributed to investments in High Bandwidth Memory (HBM).
Micron’s Chief Operating Officer, Manish Bhatia, stated that the scale of the HBM business is expected to expand to several billion dollars in the 2025 fiscal year.
As per a previous report by Economic Daily News, Micron’s current 8-layer stacking model offers the advantage of higher heat dissipation efficiency, as fewer layers allow for better cooling, ensuring stable chip performance. Additionally, Micron is planning to launch a 12-layer stacked 36Gb DRAM chip. Per a report from Tom’s Hardware, this new chip’s capacity is expected to be 50% greater than that of the previous 8-layer stack.
In March, Micron CEO Sanjay Mehrotra indicated that the company’s HBM earmarked for AI applications are sold out for 2024, with much of the 2025 supply already allocated.
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(Photo credit: Micron)