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[News] Amid Growing HBM Demand, SK Hynix Chairman Reportedly Considers Production in Japan and the US


2024-05-27 Semiconductors editor

According to a report by Nikkei News, SK Hynix is considering expanding its investment to Japan and the US to increase HBM production and meet customer demand.

Reportedly, the demand for high-bandwidth memory (HBM) is surging thanks to the AI boom. SK Group Chairman and CEO Chey Tae-won stated at the Future of Asia forum in Tokyo on May 23rd that if overseas investment becomes necessary, the company would consider manufacturing these products in Japan and the United States.

Chey Tae-won also mentioned that SK will further strengthen its partnerships with Japanese chip manufacturing equipment makers and materials suppliers, considering increased investments in Japan. He emphasized that collaboration with Japanese suppliers is crucial for advanced semiconductor manufacturing.

When selecting chip manufacturing sites, Chey highlighted the importance of accessing clean energy, as customers are demanding significant reductions in supply chain greenhouse gas emissions.

Additionally, Chey stated that SK intends to enhance R&D collaboration with Japanese partners for next-generation semiconductor products.

Kwon Jae-soon, a senior executive at SK Hynix, stated in a report published by the Financial Times on May 21 that the yield rate of their HBM3e is approaching the 80% target, and the production time has been reduced by 50%.

Kwon emphasized that the company’s goal this year is to produce 8-layer stacked HBM3e, as this is what customers need the most. He noted that improving yield rates is becoming increasingly important to maintain a leading position in the AI era.

SK Hynix’s HBM capacity is almost fully booked through next year. The company plans to collaborate with TSMC to mass-produce more advanced HBM4 chips starting next year.

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(Photo credit: SK Hynix)

Please note that this article cites information from Nikkei News and Financial Times.

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