[News] Jensen Huang Confirms NVIDIA Approaches Certification of Samsung’s HBM Chips

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NVIDIA CEO Jensen Huang revealed that Samsung’s High Bandwidth Memory (HBM) is still striving on the certification process, but is one step away from beginning supply.

According to a report from Bloomberg on June 4th, Huang, during a briefing at the COMPUTEX, told reporters that NVIDIA is evaluating HBM provided by both Samsung and Micron Technology. Huang mentioned that there is still some engineering work needed to be completed, expressing the desire for it to have been finished already.

As per Huang, though Samsung hasn’t failed any qualification tests, its HBM product required additional engineering work. When asked about Reuter’s previous report concerning overheating and power consumption issues with Samsung’s HBM, Huang simply remarked, “there’s no story there.”

Previously, Reuters cited sources on May 24th, reporting that overheating and power consumption issues would affect Samsung’s fourth-generation HBM chip, “HBM3,” as well as the fifth-generation “HBM3e” planned for release by Samsung and its competitors this year.

Per the same report from Reuters, Samsung has been attempting to pass NVIDIA’s tests for HBM3 and HBM3e since last year, while a test for Samsung’s 8-layer and 12-layer HBM3e chips was said to fail in April.

In an official statement, Samsung noted that it is in the process of optimizing products through close collaboration with customers, with testing proceeding smoothly and as planned. The company said that HBM is a customized memory product, which requires optimization processes in tandem with customers’ needs.

Currently, SK Hynix is the primary supplier of NVIDIA’s HBM3 and HBM3e. According to an earlier TrendForce’s analysis, NVIDIA’s upcoming B100 or H200 models will incorporate advanced HBM3e, while the current HBM3 supply for NVIDIA’s H100 solution is primarily met by SK Hynix.

According to a report from the Financial Times in May, SK hynix has successfully reduced the time needed for mass production of HBM3e chips by 50%, while close to achieving the target yield of 80%.

Read more

• [News] Reasons for Samsung’s HBM Chips Failing Nvidia Tests Revealed, Reportedly Due to Heat and Power Consumption Issues
• [News] Samsung Reportedly Establishes New HBM Team, Looking to Improve AI Chip Yield

(Photo credit: Samsung)