[News] ASE Sets Up New Facility in Kaohsiung for Advanced Packaging, Targeting Completion in 2026 

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According to a report from CNA, Taiwanese semiconductor testing and packaging giant ASE announced on June 21st that it will collaborate with Hung Ching Development & Construction Corporation to jointly build the K28 plant in Kaohsiung. Scheduled for completion in Q4 2026, the facility will reportedly focus on advanced packaging and final testing in order to meet the high-performance computing and cooling demands of AI chips.

ASE’s CFO Joseph Tung stated that ASE Semiconductor is planning for operational growth at its Kaohsiung facilities. To meet the demand for advanced packaging processes, high-performance computing for AI chips and cooling, the company is developing land in Dashe, Kaohsiung in two phases. The first phase, K27 plant, was completed and moved-in in 2023, while the K28 plant, the second phase, aims to be completed by Q4 2026.

As reported by CNA citing sources, ASE Kaohsiung Plant contributes approximately 20% to ASE Technology Holding Co., Ltd.’s total revenue. The plant specializes in providing services such as packaging, wafer bumping, probe testing, materials, and final testing. It has also developed several smart factories focusing on advanced processes, including Fan-out packaging, System-in-Package (SiP), wafer bumping, and Flip Chip packaging.

These technologies are primarily used in automotive, medical, IoT, high-speed computing, artificial intelligence, and application processor fields.

Read more

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