[News] Rising HBM Production by Samsung and SK Hynix Energizes Korea’s TC Bonder Industry

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Orders for thermal compression (TC) bonders from South Korean semiconductor equipment manufacturers are experiencing a surge, fueled by Samsung Electronics and SK Hynix ramping up their high-bandwidth memory (HBM) production. TC bonders play a pivotal role in HBM production by employing thermal compression to bond and stack chips on processed wafers, thereby significantly influencing HBM yield.

According to industry sources cited by The Chosun Daily, Samsung Electronics’ subsidiary SEMES has delivered nearly 100 TC bonders over the past year. Meanwhile, SK Hynix has inked a approximately $107.98 million contract with HANMI Semiconductor, which commands a 65% share of the TC bonder market.

Samsung Electronics and SK Hynix have developed distinct supply chains for thermal compression (TC) bonders. Samsung sources its equipment from Japan’s Toray and Sinkawa, as well as its subsidiary SEMES. In contrast, SK Hynix relies on Singapore’s ASMPT, HANMI Semiconductor, and Hanhwa Precision Machinery. Since last year, both companies have intensified localization efforts to decrease reliance on foreign equipment.

According to the Chosun Daily, HANMI Semiconductor, which co-developed TC bonders with SK Hynix in 2017, provides equipment for SK Hynix’s MR-MUF process, using an adhesive-like material for bonding DRAM chips. While HANMI’s TC bonders are compatible with both TC-NCF and MR-MUF processes, they are currently supplied only to SK Hynix and Micron.

On the other hand, SEMES, a specialist in TC bonders for the TC-NCF process used in high-bandwidth memory (HBM) stacking, supplies its equipment to Samsung. SEMES aims to exceed 250 billion won in TC bonder sales this year, up from around 100 billion won last year.

Regarding the HBM market, TrendForce notes that HBM3e may become the market mainstream for 2024, which is expected to account for 35% of advanced process wafer input by the end of 2024.

(Photo credit: SK hynix)