[News] TSMC Reportedly Invests over USD 12.3 Billion in EUV, Advancing in 2nm Production

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TSMC’s advanced 2-nanometer process capacity is set to begin mass production in 2025, with equipment manufacturers actively delivering machines. According to a report from Commercial Times, the EUV (Extreme Ultraviolet Lithography) machines, crucial for advanced processes, will see over 60 units delivered this year and next, with a total investment exceeding TWD 400 billion (roughly USD 12.3 billion).

As production capacity continues to expand, ASML’s delivery volume in 2025 is expected to grow by more than 30%, benefiting the Taiwanese supply chain. Among them, Gudeng Precision is actively collaborating with ASML on next-generation High-NA EUV development, while other Taiwanese fab tool makers, such as Marketech International and YEEDEX, are also expected to benefit.

As per the same report citing sources, it’s revealed that EUV machine supply is tight, with lead times of 16 to 20 months. Therefore, most orders placed in 2024 will be delivered starting the following year. According to the projections cited by the report, TSMC has ordered 30 EUV machines this year and 35 next year, though these numbers may be slightly adjusted due to capital expenditure plans.

In response to customer demand, ASML planned new capacity last year, with a clear growth trajectory for deliveries next year. Reportedly, the total delivery count for this year is estimated at 53 units, with next year’s count expected to exceed 72 units. Previously, according to a report from Reuters on June 5th, ASML already predicted that TSMC was expected to receive ASML’s latest High-NA EUV lithography equipment sometime this year.

The sources cited by Commercial Times further indicate that ASML’s capacity planning for 2025 remains unchanged, targeting 90 EUV units, 600 DUV units, and 20 High-NA EUV units. On November 14, ASML will hold its 2024 Investor Day, where it will present the latest five-year roadmap.

TSMC’s advanced process capacity is gradually ramping up. For the Tainan 3nm plant, mass production will begin in the third quarter, and EUV machines will be introduced progressively at the P8 plant next year. The Hsinchu Baoshan 2nm plant will see strong EUV equipment demand over the next three years, and the Kaohsiung 2nm plant is also advancing simultaneously.

The increasing number of EUV machines is simultaneously driving the growth in the usage of EUV mask boxes. Reportedly, it’s believed that Gudeng Precision will be among the most benefited companies. Gudeng continues to capture market share for FOUP (Front Opening Unified Pod) by maintaining a clean environment that removes plastic or contaminant particles and delivers ready-to-use products directly to customer sites. Additionally, Gudeng is also involved in collaborative development for ASML’s High-NA EUV.

Read more

• [News] ASML Projects Strong Demand Until 2026, New EUV Shipments Reportedly to TSMC
• [News] Decipher TSMC’s Calm Take on High-NA EUV Lithography Machines: Who May Have the Last Laugh in the Angstrom Era?

(Photo credit: ASML)