[News] US and Japan Semiconductor Firms Form Next-Generation Semiconductor Packaging Alliance

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According to an official release of Japanese semiconductor supplier Resonac, the “US-JOINT” alliance, comprising major semiconductor manufacturing companies from Japan and the United States, has been established to focus on next-generation semiconductor packaging. From Japan, six companies are participating, led by Resonac, MEC, Urvac, Namix, TOK, and Towa. The US participants include Azimuth, KLA, Kulicke & Soffa, and Moses Lake Industries.

In this alliance, Japanese companies primarily represent the materials sector, while the US companies include not only a materials company (Moses Lake) but also a packaging equipment company (Kulicke & Soffa), a measurement and inspection company (KLA), and a packaging services company (Azimuth).

Reportedly, US-JOINT will jointly establish a research center in the United States and plans to set up a base in California in the second half of this year. The construction of cleanrooms and the installation of equipment will begin, with the goal of starting operations next year.

As per industry sources cited by the China Flash Market, it is believed that the formation of this alliance primarily targets the US semiconductor market. The US is home to many world-class technology companies, such as NVIDIA, Qualcomm, and AMD, which are key customers in the high-tech packaging market.

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(Photo credit: Resonac)