[News] Equipment Manufacturers’ Global Race for Hybrid Bonding Opportunities

Global semiconductor giants are concentrating their R&D efforts on advanced packaging technologies to drive performance enhancements. According to a report from Commercial Times, as packaging technology progresses from 2.5D to 3D, chip stacking technologies have become a showcase for the competitive prowess of major companies.

“Hybrid Bonding” is seen as the key technology for future chip connections. In addition to international companies like Applied Materials and Besi actively positioning themselves, Taiwanese companies led by TSMC, including Gallant Micro, MPI Corporation, E&R Engineering Corporation, C SUN, Saultech, and Grand Process Technology, are also developing and seizing opportunities in Hybrid Bonding.

The report also cited industry sources, pointing out that Grand Process Technology has been supplying TSMC since the inception of InFO (Integrated Fan-Out Packaging). It is revealed that Grand Process Technology is also actively participating in future SoIC (System on Integrated Chips) advanced packaging, focusing on wafer cleaning and photoresist removal in etching processes.

It is indicated by the report that Grand Process Technology’s capacity will be operating at full speed until the first quarter of next year, with lead times extended to nine months. Last year’s orders are currently being installed gradually, with most concentrated on advanced packaging.

Semiconductor equipment manufacturer C SUN and its investment company Gallant Micro are currently investing in Hybrid Bonding-related equipment. C SUN primarily focuses on developing the best solutions for permanent bonding to enhance yield rates. Meanwhile, Gallant Micro leverages its relative advantage in chip sorting machines within its product line.

MPI Corporation, a testing interface vendor, has also entered the initial stages of inspection and analysis for Hybrid Bonding processes. Development of related products is nearing completion.

E&R Engineering Corporation also emphasizes that its top-tier plasma cleaning equipment is currently aimed at achieving high cleanliness of bonding surfaces to enhance adhesion.

Saultech Technology holds a positive outlook on the future market trends of Hybrid Bonding as well. The company has introduced equipment that corresponds to both Hybrid Bonding and Fan-Out technologies. Saultech has independently developed key technologies including bonding and die cleaning processes.

Read more

• [News] Samsung and SK hynix to Implement Hybrid Bonding with 3D DRAM
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(Photo credit: Applied Materials)