[News] ChangXin Memory Technologies in China Has Reportedly Begun Mass Production of HBM2

According to a report from Tom’s Hardware citing industry sources, it’s indicated that Chinese memory giant ChangXin Memory Technologies (CXMT) has started mass production of HBM2. If confirmed, this is approximately two years ahead of the expected timeline, although the yield rate for HBM2 is still uncertain.

Earlier, Nikkei once reported that CXMT had begun procuring equipment necessary for HBM production, estimating it would take one to two years to achieve mass production. Currently, CXMT has ordered equipment from suppliers in the U.S. and Japan, with American companies Applied Materials and Lam Research having received export licenses.

Reportedly, HBM2 has a per-pin data transfer rate of approximately 2 GT/s to 3.2 GT/s. Producing HBM2 does not require the latest lithography techniques but does demand enough manufacturing capacity.

The process involves using through-silicon vias (TSV) to vertically connect memory components, which is rather complex. However, packaging the HBM KGSD (known good stack die) modules is still less intricate than manufacturing traditional DRAM devices using a 10nm process.

CXMT’s DRAM technology is said to be lagging behind that of Micron, Samsung, and SK hynix. These three companies have already started mass production of HBM3 and HBM3e and are preparing to advance to HBM4 in the coming years.

There also are reports indicating that Huawei, the Chinese tech giant subject to US sanctions, looks to collaborate with other local companies to produce HBM2 by 2026. Per a previous report from The Information, a group led by Huawei aimed at producing HBM includes Fujian Jinhua Integrated Circuit.

Moreover, since Huawei’s Ascend 910 series processors use HBM2, it has made HBM2 a crucial technology for advanced AI and HPC processors in China. Therefore, local manufacturing of HBM2 is a significant milestone for the country.

Read more

• [News] Bypassing U.S. Restrictions? CXMT Showcases GAA Technology for 3nm Chips
• [News] Progress Made in Chinese Consortium’s Development of HBM, Reportedly Targeting HBM2 Production by 2026

(Photo credit: CXMT)