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[News] Samsung Reportedly Confirms Investment in Pyeongtaek P4 Plant for 6th-Generation 1c DRAM


2024-08-13 Semiconductors editor

Facing increased market demand and the ongoing recovery of the memory industry, a report from Korean media outlet ETNews has reported that Samsung has confirmed its investment plan for the 6th-Generation DRAM production line at the Pyeongtaek P4 plant, with the goal of starting mass production in June 2025.

Reportedly, the 6th-generation DRAM, known as ‘1c ,’ is a next-generation DRAM utilizing 10nm-class technology. Despite it is said to be a product that has not yet been commercialized in the global semiconductor industry, both Samsung Electronics and SK hynix are already preparing for mass production.

Samsung’s Pyeongtaek P4 is a comprehensive semiconductor production center, divided into four phases.

Samsung Electronics reportedly planned to begin construction on the P4 facility in 2022 and commence operations this year. However, even after completing the P4 building and essential infrastructure like electricity and water, the company did not proceed with building a production line. Due the downturn in the semiconductor market, Samsung adopted a downsizing strategy by scaling back its existing facilities.

As the semiconductor market started to recover in the second half of last year, Samsung Electronics shifted towards expansion and investment by mid-year. The company began installing NAND flash equipment in the previously unused P4 facility and has now confirmed its investment in 1c DRAM production.

As per ETNews, Samsung plans to initiate 1c DRAM production by the end of this year. The company is said to be considering launching HBM4 using 1c DRAM in the second half of 2025.

Given that HBM consumes significantly more DRAM than traditional memory, it is speculated by the report that Samsung’s construction of the 1c DRAM production line at the Pyeongtaek P4 plant may also be in preparation for HBM4.

As per TrendForce’s latest report on the memory industry, it’s revealed that DRAM and NAND Flash revenues are expected to see significant increases of 75% and 77%, respectively, in 2024, driven by increased bit demand, an improved supply-demand structure, and the rise of high-value products like HBM.

Furthermore, TrendForce also reports that Samsung’s P4L facility will be the key site for expanding memory capacity starting in 2025, starting with NAND production. Equipment installation for DRAM is expected to begin in mid-2025, with mass production of 1c nanometer DRAM slated to commence in 2026.

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(Photo credit: Samsung)

Please note that this article cites information from ETNews and Korea Economic Daily.

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