[Insights] Memory Spot Price Update: NAND Prices for Package Dies and Wafers Dropped Slightly due to Slow Transactions

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According to TrendForce’s latest memory spot price trend report, regarding DRAM spot prices, demand has yet to show improvement, leading to increased inventory pressure on suppliers, which indicates the potential for larger price drops in the future. As for NAND flash, the overall price trend is still shifting to a reduction, which led to a small drop in prices for packaged dies and wafers from the spot market. Details are as follows:

DRAM Spot Price:

Continuing from last week, demand has yet to show improvement, leading to increased inventory pressure on suppliers. Consequently, suppliers are more willing to offer price concessions in the spot market. Overall, spot transactions continue to show low volumes. Additionally, the prices that buyers are willing to accept are significantly lower than the official prices set by sellers, resulting in a stalemate. Therefore, there is a potential for larger price drops in the future. The average spot price of mainstream chips (i.e., 1Gx8 2666MT/s) fell by 0.20% from US$1.989 last week to US$1.985 this week.

NAND Flash Spot Price:

Sluggishness persists among spot market transactions after the opening in August, where buyers are maintaining their strong on-the-fence sentiment. Despite emergence of demand for partial stocking orders, the overall price trend is still shifting to a reduction due to a lack of continuity, which led to a small drop in prices for packaged dies and wafers from the spot market this week, where 512Gb TLC wafer has fallen by 0.58% in spot prices, now arriving at US$3.272.