[News] HBM Technological Battle to be on the Next Level

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Per a report by BusinessKorea, SK hynix Vice President Ryu Seong-su announced the company’s strategic plan in the HBM field during the SK Group Icheon Forum 2024 held on August 19. SK hynix plans to develop a product that boasts dozen of times the performance of existing HBM technologies.

The report indicates that SK hynix aims to develop a product with performance 20 to 30 times higher than current HBM offerings, achieving product differentiation.

During the forum, Ryu Seong-su emphasized that SK hynix will concentrate on leveraging advanced execution capabilities to provide memory solutions tailored for the AI (Artificial Intelligence) sector to meet the demands of the mass market.

• Seven Giants Proposed Customized Demands for HBM

Amid AI advancements, the demand for high-performance HBM has been on the rise, making it a hotspot among global high-tech companies.

According to Ryu Seong-su, Apple, Microsoft, Google Alphabet, Amazon, NVIDIA, Meta, and Tesla—seven of the world’s tech giants—have all engaged with SK hynix , seeking customized HBM solutions tailored to their specific needs.

Compared to existing HBM products, customized HBM offers clients more options in terms of PPA (Performance, Power, Area), thereby delivering more substantial value.

For example, Samsung believes that the power consumption and area of semiconductors can be largely reduced by stacking HBM memory with custom logic chips in a 3D configuration.

On this trend towards customization in the HBM sector, TrendForce predicted that HBM industry will become more customization-oriented in the future. Unlike other DRAM products, HBM will increasingly break away from the standard DRAM framework in terms of pricing and design, turning to more specialized production.

SK hynix CEO Kwak Noh-Jung also believes that as HBM4 continues to advance, the demand for customization will grow, which is likely to become a global trend and shift towards a more contract-based model. Moreover, it is expected to mitigate the risk of oversupply in the memory market.

In fact, HBM market is gradually evolving from a “general-purpose” to a “customization-oriented” market with the rise of AI. Later, as breakthroughs are made in speed, capacity, power consumption, and cost, HBM is poised to play an even more critical role in the AI sector.

• Customized HBM to Become a Reality in the HBM4 Generation

Currently, buyers have already begun making customized requests for HBM4, and both SK hynix and Samsung Electronics have developed strategies to address these demands.

SK hynix has been in collaboration with TSMC to develop the sixth generation of HBM products, known as HBM4, which is expected to enter production in 2026.

Unlike previous generations, inclusive of the fifth-generation HBM3E, which were based on SK hynix’s own process technology, HBM4 will leverage TSMC’s advanced logic process, which is anticipated to significantly enhance the performance of HBM products.

Additionally, adopting ultra-fine processing technology for the base die could enable the addition of more features.

SK hynix has stated that with these two major technological upgrades, the company plans to produce HBM products that excel in performance and efficiency, thereby meeting the demand for customized HBM solutions.

Ryu Seong-su believes that as customized products enjoy burgeoning growth, memory industry is approaching a critical point of paradigm shift, and SK hynix will continue to make advantage of the opportunities presented by these changes to advance its memory business.

Meanwhile, Samsung Electronics, as a leading IDM semiconductor company with capabilities in wafer foundry, memory, and packaging, is also actively promoting customized HBM AI solutions.

In July 2024, Choi Jang-seok, head of the new business planning group at Samsung Electronics’ memory division, stated at the “Samsung Foundry Forum” that the company intends to develop a variety of customized HBM memory products for the HBM4 generation and announced collaborations with major clients like AMD and Apple.

Choi Jang-seok pointed out that the HBM architecture is undergoing profound changes, with many customers shifting from traditional general-purpose HBM to customized products. Samsung Electronics believes that customized HBM will become a reality in the HBM4 generation.

Read more

• [News] Samsung Reportedly to Tape out HBM4 with 1c DRAM by Year-end
• [News] SK hynix CEO: Demand for Memory Chips to Remain Robust until 1H25, Driven by HBM

(Photo credit: Micron)