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[News] SK hynix Reportedly Plans to Implement Chiplet Technology in Memory Controllers within Three Years
As designing and manufacturing large monolithic ICs became more complex, related challenges regarding yield and cost have emerged for semiconductor companies, which boosts the popularity of chiplets. Now the wave has been spreading to the memory sector. According to a report by TheElec, SK hynix intends to integrate the chiplet technology into its memory controllers over the next three years to improve cost management.
In January, the company applied for a brand name called MOSAIC, which represents its chiplet technology, the report notes.
Citing SK hynix Executive Vice President Moon Ki-ill, the report notes that the company currently collaborates with TSMC as the foundry for manufacturing its controllers.
However, within the next two to three years, parts of the controller would be manufactured with advanced nodes, while other sections will use legacy nodes, the report states. Moon added that the company is currently developing technology to connect these different sections.
Moon further explains that while TSMC manufactures the controllers for SK hynix, the memory giant itself is responsible for the packaging work. In the future, under the structure of chiplets, a chip can be divided into separate parts with various functions, and then reconnected to achieve similar performances as if they were a single integrated chip, according to TheElec.
In this scenario, function A might use TSMC’s 7nm node, while function B and C could be produced using legacy nodes from TSMC or another foundry. This approach would enables SK hynix to better manage the costs of its DRAM and NAND products, the report notes.
According to the definition of EDA and Intelligent System Design provider Cadence, chiplet technology results in versatile and customizable modular chips, which leads to reduced development timelines and costs.
The creation and adoption of chiplet standards like UCIe enable seamless integration of chiplets into System-on-Chips (SoCs), unlocking new possibilities in computing and technology applications, according to Cadence.
In addition to SK hynix, Samsung has also brought up plans to adopt the chiplet technology. In July, according to an announcement with Japanese startup Preferred Networks, the two companies plan to showcase groundbreaking AI chiplet solutions for the next-generation data center and generative AI computing market.
According to an earlier report by Gizmochina, Samsung is also said to be mulling to apply 3D chiplet technology to its Exynos mobile APs.
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(Photo credit: SK hynix)
