[News] Google Reportedly Adopts TSMC’s N3P Process instead of 2nm for Tensor G6

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According to a report from Wccftech, Google is rumored to switch to TSMC’s second-generation 3nm process, “N3E”, for its Tensor G5. The report also claims that for the Tensor G6, Google will utilize TSMC’s “N3P” process instead of the 2nm process speculated earlier. Its entire Pixel 10 series set to be launched next year will use TSMC’s 3nm process.

The report suggests that the Tensor G4 processor may be the last Google chipset manufactured by Samsung using its 4nm process, since the Tensor G4 reportedly offers only a slight upgrade compared to the Tensor G3 in the Pixel 8 smartphone, as it continues to use Samsung’s older FO-PLP packaging technology instead of the newer FO-WLP packaging, which is more capable in preventing overheating.

Notably, the report states that Qualcomm and MediaTek have also adopted the 3nm “N3E” process for their Snapdragon 8 Elite and Dimensity 9400 chipsets for the first time this year, having bridged the technological gap with Apple.

Therefore, the report notes that Google will still be a year behind in the competition when it announces the Tensor G5 and Tensor G6, since Qualcomm, MediaTek, and Apple are already using TSMC’s 3nm process and are expected to shift to N3P.

According to the report, the Tensor G5 was reported to have reached the tape-out stage earlier this year and is expected to use TSMC’s InFO-POP packaging, which allows the chipset’s packaging to be smaller and also more power efficient.

Regarding Tensor G6, it will likely launch two years from now. Although it was previously rumored that Tensor G6 will use TSMC’s 2nm process, the report indicates that it will instead utilize TSMC’s enhanced version of 3nm, N3P node.

According to a report from AnandTech, as a more enhanced process node compared to N3E, N3P offers better performance with higher transistor density and reduced power consumption.

The report indicates that it makes sense that Google is not opting to adopt the 2nm process immediately, especially since even Apple is expected to wait until the launch of the iPhone 18, two years from now, to introduce its first A-series chipsets that will exceed the 3nm barrier. Additionally, it is expected that the 2nm A-series chipsets will not be included in all iPhone 18 models due to their high cost.

Read more

• [News] TSMC Rumored to Secure Tensor G6 Orders from Google with Its 2nm Process
• [News] Google’s Tensor G5 Reportedly Manufactured with TSMC’s 3nm and InFO-POP Packaging

(Photo credit: Google)