[News] SK Hynix’s HBM4 to Use TSMC’s 3nm Base Die

The Korea Economic Daily reports that SK Hynix, a leading manufacturer of AI memory chips, plans to produce its sixth-generation high-bandwidth memory (HBM4) chips using TSMC’s 3nm process technology. These chips are slated for delivery to NVIDIA in the second half of next year.

The report notes that SK Hynix initially intended to use a 5nm process for HBM4 production. However, due to major customer demands for more advanced memory, the company shifted to the 3nm process, with shipments to NVIDIA expected in the second half of 2025.

According to the report, SK Hynix’s prototype HBM4 chip, unveiled in March, features vertically stacked dies on a 3nm base die. Compared to 5nm base dies, the 3nm-based HBM chips are expected to deliver a 20–30% performance boost. However, SK Hynix’s general-use HBM4 and HBM4E chips will utilize a 12nm process in collaboration with TSMC.

The same report indicates that SK Hynix’s fifth-generation HBM3E chips rely on its own base die technology, but the company has opted to use TSMC’s 3nm technology for HBM4. This decision is anticipated to substantially widen the performance gap with its competitor, Samsung Electronics, which plans to manufacture its HBM4 chips using a 4nm process.

(Photo credit: SK Hynix)