[News] Innolux Delays FOPLP Mass Production to First Half of 2025

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According to a report by the Commercial Times, Jin-Yang Hung, Chairman of panel manufacturing giant Innolux, expressed cautious optimism for the company’s outlook in 2024. He noted that demand and pricing for TV panels are likely to recover, while PC panels are expected to see modest growth. However, the highly anticipated mass production of fan-out panel-level packaging (FOPLP), originally slated for the end of this year, has encountered some delays.

The report quoted Hung as saying that Innolux had repurposed its older Generation 3.5 fab to develop FOPLP technology, with mass production initially planned for late 2024. However, progress has been adjusted due to several factors. These include the additional time required to master new technologies and shifts in customer demand. Specifically, while the initial focus was on power management ICs for smartphones, sluggish smartphone demand led clients to revise their plans. As a result, Innolux is exploring alternative applications, such as automotive use cases. However, the longer verification cycles for these new applications may push mass production to the first half of next year.

In a related development, Innolux, CarUX, and Japan Display Inc. (JDI) signed an agreement on November 3 to form the eLEAP Strategic Alliance. The partnership aims to provide innovative eLEAP display products and solutions to global clients. Hung emphasized that Innolux’s strengths lie in production and efficiency, while JDI’s advanced technology offers a competitive edge. The collaboration is expected to optimize production capacity, lower costs, and reorganize the supply chain to better serve customers. CarUX will focus on product promotion to end clients, positioning the alliance as a “World Cup-level” effort.

Innolux plans to actively promote these innovations at the upcoming CES, with a goal of launching new projects by 2027.

(Photo credit: Innolux)