[News] TSMC Ramps up CoWoS Capacity across Taiwan, Projected to Nearly Triple by 2026

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According to a report from Commercial Times, TSMC is actively expanding its advanced packaging facilities in Taiwan. With the Tainan facility (AP8) it acquired earlier from Innolux starting small-scale production by the end of 2025, TSMC’s CoWoS capacity is expected to triple, rising to 90,000 wafers per month by the end of 2026, as noted by the report.

In addition to AP8, The AP6B Fab in Zhunan, northern Taiwan, received its occupancy permit on December 3rd. Construction of the Chiayi plant, which began in May this year, is also progressing rapidly, with the steel framework already taking shape. The AP5B Fab in Taichung, on the other hand, is expected to begin operations in the first half of 2025.

The report points out that, citing institutional investors, TSMC’s monthly CoWoS production capacity reaches 35,000 wafers this year, contributing approximately 7%–9% of the company’s total revenue. By the end of 2025, its monthly CoWoS capacity is projected to reach 70,000 wafers, with its revenue contribution surpassing 10%. By the end of 2026, capacity is expected to grow further to 90,000 wafers per month.

From 2022 to 2026, TSMC’s CoWoS capacity is anticipated to grow at a compound annual growth rate (CAGR) of 50% and is expected to continue expanding through 2026, as noted in the report.

Notably, TSMC’s AP8 plant is expected to operate by the end of 2025, with a floor area estimated to support a monthly production capacity of 40,000–50,000 wafers, according to the report, citing supply chain sources. Based on this estimation, TSMC is unlikely to dedicate the entire facility solely to CoWoS production. Instead, it is expected to allocate capacity for SoIC (System on Integrated Chips), CPO (Co-packaged Optics), and FoPLP (Fan-Out Panel-Level Packaging), as the report indicates.

Read more

• [News] TSMC’s CoWoS Capacity Doubles for Two Years, Still Insufficient—Positive Outlook for Suppliers
• [News] TSMC on Track to Qualify Ultra-Large CoWoS with 9x Reticle Sizes, 12 HBM4 Stacks by 2027

(Photo credit: TSMC)