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[News] SK hynix Gears up for 16H HBM3E Mass Production in 2025, with Early Testing Showing Positive Results
In early November, SK hynix CEO Kwak Noh-Jung introduced the world’s first 48GB 16-high HBM3E at SK AI Summit in Seoul. Now, before the year 2024 draws to an end, the HBM giant is gearing up for the mass production of the product, as early testing of key processes reportedly shows promising results, according to South Korean media outlet ETNews.
Industry sources cited by ETNews revealed that SK hynix is integrating new equipment for HBM3E 16-stack production and optimizing existing facilities. Production tests are said to be underway, targeting supply in the first half of 2025, the report suggests.
In late September, SK hynix announced that it has begun mass production of the world’s first 12-layer HBM3E product with 36GB. The 16-layer HBM3E product, according to its press release, can improve AI learning performance and inference performance by up to 18% and 32%, respectively, compared to the 12-layer HBM3E.
Though the market for 16-high HBM is expected to open up from the HBM4 generation, SK hynix has been developing 48GB 16-high HBM3E in a bid to secure technological stability and reportedly plans to provide samples to customers in early 2025.
According to ETNews, SK hynix’s acceleration of next-gen HBM development is aimed at meeting the faster product cycles of clients like NVIDIA. The HBM3E 16-stack is expected to feature prominently in the next iteration of NVIDIA’s latest AI accelerator, Blackwell, the report adds.
According to a previous report by Reuters, NVIDIA CEO Jensen Huang requested SK hynix to accelerate the supply of HBM4 by six months.
In addition to NVIDIA, SK hynix is rumored to be securing major HBM orders from other tech giants, such as Broadcom, as indicated by The Elec.
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(Photo credit: SK hynix)
