[News] Chinese DRAM Giant CXMT Reportedly Achieves 80% DDR5 Yield, Targeting 90% by 2025

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Amid the advancements for global DRAM giants like SK hynix and Samsung, rumors have been circulating that China’s top DRAM manufacturer CXMT is suffering from a 10-20% yield in DDR5. However, according to TechPowerUp and MyDrivers, CXMT has made notable strides in DDR5 production, as the yield rate has reportedly reached 80%.

According to the reports, citing an analyst report, this represents a significant leap from the initial 50% yield when production first began. Notably, the reports indicate that CXMT aims to further increase DDR5 yields to around 90% by the end of 2025.

The reports note that for now, CXMT operates two fabs in Hefei. The first fab is understood to be focused on DDR4 production with a capacity of 100,000 wafers per month, using 19nm. CXMT has reportedly achieved a 90% yield for DDR4.

On the other hand, the second fab features DDR5 production with 17 nm, with its monthly capacity currently reaching 50,000 wafers, as per the reports. Despite these improvements, this marks a huge gap with Samsung and SK hynix, as they manufacture DDR5 chips with the more advanced 12 nm node, the report add.

Looking ahead, CXMT still aims high for its DRAM roadmap, as it plans to expand its DDR5 and HBM production capabilities. According to the reports, the Chinese DRAM giant is expected to add another 50,000 wafers capacity per month to Fab 2 in 2025, with customer sampling for HBM2 already in progress and low-volume production expected to begin by mid-2025.

The MyDrivers report further notes that although the major market players have already mass-produced HBM3 and HBM3E and are set to release HBM4, making progress in HBM2 is still a milestone for CXMT.

It is worth noting that CXMT’s advancements in HBM2 is crucial for the development of domestically produced AI hardware, such as Huawei’s Ascend 910 series accelerator, which relies on CXMT’s HBM products, the report notes.

The My Drviers report indicates that CXMT started acquiring HBM2 production equipment in the third quarter of 2024, including machines related to advanced packaging, such as TSV and KGSD.

Read more

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(Photo credit: CXMT)