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[News] TSMC Set to Expand CoWoS Capacity to Record 75,000 Wafers in 2025, Doubling 2024 Output


2025-01-02 Semiconductors editor

TSMC is actively expanding its advanced packaging CoWoS capacity, with progress reportedly on track, according to Economic Daily News. Industry sources estimate that, with the inclusion of production capacity from facilities acquired from Innolux (AP8) and those in Taichung, TSMC’s CoWoS monthly capacity could reach a record high of 75,000 wafers in 2025—nearly doubling 2024 levels. The expansion is expected to continue through 2026 to meet robust market demand.

The report also highlights that, alongside TSMC’s own capacity expansion efforts, its packaging partners, such as ASE Technology Holding and U.S.-based packaging giant Amkor, are also contributing capacity. Sources indicate that, if combined, these efforts could drive the overall monthly capacity target for 2025 beyond 75,000 wafers, potentially reaching this milestone ahead of schedule.

Driven by strong customer demand, TSMC has maintained a steadfast focus on expanding its advanced packaging capacity. During a previous earnings call, TSMC Chairman and CEO C.C. Wei acknowledged that CoWoS capacity has been facing short supply, as the report notes. To address this, TSMC is actively expanding its capacity while collaborating with packaging partners, aiming to achieve a balance between supply and demand by 2025-2026.

The report cites TSMC Vice President of Advanced Packaging Technology and Service, Jun He, who stated that TSMC’s CoWoS capacity is projected to achieve a compound annual growth rate (CAGR) of over 50% from 2022 to 2026. Furthermore, the timeline for constructing CoWoS facilities has been significantly accelerated. While it previously took three to five years to build such facilities, the process has now been shortened to just one and a half to two years.

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(Photo credit: TSMC)

Please note that this article cites information from Economic Daily News.

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