[News] SK hynix to Showcase 16-layer HBM3E Samples at CES 2025, along with eSSD, CXL Developments

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South Korean memory giant SK hynix announced in late September, 2024, that it has begun mass production of the world’s first 12-layer HBM3E with 36GB. Now it seems that the company is making good progress on 16-layer products as well. According to its press release, SK hynix will showcase its 16-layer HBM3E prototype at CES 2025, held in Las Vegas from January 7 to 10.

Notably, SK hynix states that its HBM3E 16-layer products were officially developed in November, 2024. According to SK hynix, it leverages the advanced MR-MUF process to achieve a leading 16-layer configuration, effectively minimizing chip warpage and optimizing heat dissipation.

The 16-layer HBM3E product, according to the company, can improve AI learning performance and inference performance by up to 18% and 32%, respectively, compared to the 12-layer HBM3E.

A previous report from ETNews suggested that production tests for SK hynix’s 16-layer HBM3E are underway, targeting supply in the first half of 2025. Another Sedaily report, citing CEO Kwak No-jung, notes that SK hynix plans to begin mass production of HBM4 in the second half of 2025.

SK hynix’s top executives, including CEO and President Kwak No-jung, AI Infrastructure President Kim Joo-sun, and Chief Development Officer Ahn Hyun, will attend the event, according to the company.

In addition to the highly anticipated 16-layer HBM3E sample, SK hynix will also showcase a diverse range of AI memory products, including high-bandwidth memory (HBM) and eSSD, along with solutions tailored for on-device AI and next-generation AI memory, as per the press release. Other highlights at CES 2025 from SK hynix are as below:

Enterprise SSD

SK hynix will showcase high-capacity, high-performance enterprise SSDs to meet the growing demand from AI data centers. This includes the 122TB D5-P5336 SSD, developed by its subsidiary Solidigm last November, as per its press release.

Compute Express Link (CXL) and Processing in Memory (PIM)

SK hynix will also display other next-gen data center technologies, including CXL and PIM, along with modular solutions like the CMM-Ax and AiMX. Notably, according to its press release, CMM-Ax enhances CXL’s high-capacity memory expansion with added computational capabilities, boosting performance and energy efficiency for next-generation server platforms.

Read more

• [News] SK hynix Rumored to Deliver Major HBM Order to Broadcom in 2025
• [News] SK hynix Gears up for 16H HBM3E Mass Production in 2025, with Early Testing Showing Positive Results

(Photo credit: SK hynix)