[News] Multiple 12-inch Wafer Lines in China Officially Commissioned!

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12-inch wafer fabs play a crucial role in semiconductor manufacturing. By the end of 2024, several major projects have made headlines. Production has commenced for five 12-inch wafer lines from Runpeng Semiconductor, Tiancheng Advanced, Yandong Microelectronics, Guangzhou Chip Semiconductor, and Hua Hong Wuxi.

Additionally, two other production lines from SMIC and Zensemi have reported significant progress. These projects primarily focus on producing power devices and advanced logic chips.

Runpeng Semiconductor’s 12-inch IC Production Line Goes Live!

On December 31, 2024, Runpeng Semiconductor held a grand ribbon-cutting ceremony to mark the launch of its 12-inch integrated circuit production line. Once operating at full capacity, the facility is expected to produce 480,000 12-inch power chips annually.

Tiancheng Advanced Officially Launches Its 12-inch Wafer-Level TSV Production Line!

On December 30, 2024, Zhuhai Tiancheng Advanced announced the official commissioning of its 12-inch wafer-level TSV (Through Silicon Via) production line. Earlier, on November 2, 2024, the company revealed that the production line had been fully connected.

TSV is a cutting-edge technology designed to elevate semiconductor performance, offering high capacity, low power consumption, and high density.

Yandong Micro Announces RMB 4.02 Billion Fundraising for 12-inch Production Line

On December 30, 2024, Beijing Yandong Microelectronics Co., Ltd. (Yandong Micro) announced plans to issue A-shares to Beijing Electronics Holdings Co., Ltd. The total proceeds from this issuance will not exceed RMB 4.02 billion, of which RMB 4 billion will be allocated to the Beidian Integrated 12-inch IC production line project.

Guangzhou Chip Semiconductor Completes Phase III of Its 12-inch Wafer Project

On December 28, 2024, a major ceremony was held at the Guangzhou Development Zone to mark the connection of the new 12-inch analog specialty process production line (Phase III) of Guangzhou Chip Semiconductor.

The project involves a total investment of RMB 16.25 billion, covering 280,000 square meters with a building area of 450,000 square meters. Utilizing 180-90nm process technology, it aims to establish an industrial-grade and automotive-grade analog specialty process platform. The project is expected to add a monthly capacity of 40,000 wafers, with an estimated annual output value of RMB 4 billion upon reaching full capacity.

Hua Hong Wuxi’s 12-inch Production Line Begins Operations

On December 10, 2024, Hua Hong Group announced that its Wuxi IC R&D and Manufacturing Base (Phase II) 12-inch production line had been completed and started production. This milestone transitions the project from construction to operational status.

Since its initiation in March 2018, Hua Hong Wuxi Base (Plant 7) has undergone two rounds of construction and expansion with a total investment exceeding USD 10 billion.

SMIC: 12-inch Wafer Monthly Capacity to Increase by 60,000 by End of 2024

In mid-2024, SMIC announced plans for capacity expansion. By the end of 2024, its 12-inch wafer monthly production capacity is expected to increase by approximately 60,000 wafers compared to the end of 2024.

Zensemi  Progresses on 12-inch Wafer Production Line

Zensemi has reported significant progress in its 12-inch wafer manufacturing line. As of August 10, 2024, the company had achieved a first-pass yield of 99.7% for its initial product batch, which passed a 168-hour high-temperature reliability test, meeting mass production standards.

By the end of 2024, Zensemi plans to deliver 10,000 wafers according to customer orders. In 2025, the company’s priorities will include capacity ramp-up, quality control, product delivery, and market development, with a target of achieving a monthly capacity of 20,000 wafers by the end of the year.

These advancements mark a significant leap forward for the semiconductor industry, underscoring the growing importance of 12-inch wafer manufacturing in powering future technological innovations.

(Photo credit: Beijing Yandong Microelectronics)