[News] SK Chair Meets with Jensen Huang, Highlighting HBM Developments Exceeding NVIDIA’s Requests

---

---

The meeting between AI accelerator giant NVIDIA and HBM leader SK hynix may be one of the most anticipated events at CES 2025. Following the talks with NVIDIA CEO Jensen Huang, SK Group Chairman Chey Tae-won confirmed the company’s positive advancements in next-gen HBMs, saying that its chip development has now outpaced NVIDIA’s demands, according to Korea JoongAng Daily.

In November, 2024, media reports indicated that NVIDIA had asked SK hynix to speed up its delivery time for HBM4 by six months. Now, citing Chey, the report from Korea JoongAng Daily notes that SK hynix is making strides, and the company’s pace exceeds NVIDIA’s requests. “It’s nearly a reversal,” said Chey.

The South Korean memory giant previously revealed that its HBM production for 2025 is already sold out, with NVIDIA being its largest customer, according to The Korea Herald.

SK hynix is showcasing its 16-layer HBM3E prototype at CES 2025, held in Las Vegas from January 7 to 10. A previous report from ETNews suggested that production tests for SK hynix’s 16-layer HBM3E are underway, targeting supply in the first half of 2025. Another Sedaily report, citing CEO Kwak No-jung, notes that SK hynix plans to begin mass production of HBM4 in the second half of 2025.

According to Bloomberg, the meeting between the two tech giants, which took place on Wednesday, focuses explore deeper collaboration in AI hardware. Key topics under discussion includes how to advance AI into the physical realm, as well as the role of SK hynix’s HBM chips in conjunction with NVIDIA’s AI accelerator, the report adds.

Citing Chey, the Korea JoongAng Daily report notes that while Korea excels in manufacturing and expertise, NVIDIA features on advancing physical AI through digital twins and platforms like Cosmos. However, no specific business collaboration was agreed upon on the topic, as noted by the report.

Read more

• [News] SK hynix Rumored to Deliver Major HBM Order to Broadcom in 2025
• [News] SK hynix to Showcase 16-layer HBM3E Samples at CES 2025, along with eSSD, CXL Developments

(Photo credit: SK hynix)