[News] Micron Races to Catch Up, Reportedly Conducts Final Tests for 16H HBM3E Production

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As South Korean memory giant SK hynix claimed that its HBM development speed has surpassed NVIDIA’s request, U.S.-headquartered Micron is also working on the next-gen HBM product at full throttle. According to a report from ETNews, Micron is currently conducting final equipment tests for the HBM3E 16-layer production, with volume manufacturing around the corner.

Citing industry sources on January 14^th, the ETNews report notes that Micron has started preparing for the mass production of 16-layer HBM3E, aiming to catch up with SK hynix.

Notably, as the current HBM leader, SK hynix began mass production of the world’s first 12-layer HBM3E product with 36GB in September, 2024. Shortly after, it kicked off the development of 16-layer HBM3E last November and is investing in equipment with plans of mass production in the first half of 2025, as highlighted in the report.

But Micron may not be far away from its archrival. If all tests proceed smoothly and no unexpected issues arise, the U.S. memory giant is expected to start equipment investment within the first half of 2025, the report adds.

As mass production could begin later this year if the company passes the quality evaluation for 16-layer HBM3E from clients like NVIDIA, it is likely to significantly close the gap with SK hynix, the report suggests.

To meet the strong demand, Micron is actively expanding its HBM capacity, both domestically and overseas. According to Micron’s press release, it breaks ground on a new HBM packaging facility in Singapore on January 8th. With an estimated investment of USD 7 billion, the site is expected to handle its latest HBM3E products, as per The Business Times.

The ETNews report further notes that as of the end of 2024, Micron’s HBM capacity was reported to be about 20% of SK hynix’s and Samsung’s, but the company is rapidly expanding. Micron’s HBM production capacity was reportedly about 20,000 units per month as of the end of 2024, and is expected to rise to 60,000 units per month by the end of 2025.

As per a previous report from Tom’s Hardware, Micron’s HBM4 is expected to enter mass production in 2026, followed by HBM4E in 2027-2028.

Read more

• [News] Micron Kicks off Construction on HBM Advanced Packaging Facility in Singapore for HBM3E Products
• [News] Micron Plans HBM4 Mass Production in 2026, Customized HBM4E to Launch in 2027-2028

(Photo credit: Micron)