[News] ASML to Ship First Second-Gen High-NA EUV Machine in the Coming Months, Aiming for 2026 Production

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Though Intel plans to lower its 2025 capex to USD 20 billion from USD 24 billion in 2024, the semiconductor giant has been gearing up to receive its new high-NA EUV machine soon. According to a report from Dutch media outlet tweakers, the first modules of ASML’s TwinScan EXE:5200 will be delivered to a customer in the coming months.

The information has been confirmed by ASML CEO Christophe Fouquet, as noted by the report.

Notably, BITS&CHIPS suggests that the timetable is in line with the goal of beginning high-NA volume production in 2026. Intel would be the first to receive the EXE:5200 for its 14A node, while TSMC may begin high-NA mass production in 2028, the report adds.

According to IT Home, the EXE:5200 is expected to achieve higher wafer throughput than EXE:5000 (exceeds 185 wafers per hour) while supporting more advanced sub-2nm processes.

ASML’s EXE:5200 will be the first high-NA production machine, following the delivery of three EXE:5000 units for R&D purposes to manufacturers like Intel and TSMC, as noted by tweakers.

Following the release of EXE:5200, ASML may develop hyper-NA EUV machines with a 0.75 numerical aperture, but no formal decision has been made, according to tweakers. ASML previously mentioned potential opportunities for hyper-NA around 2032, the report notes.

ASML maintains its 2025 sales forecast of 30-35 billion euros, marking a 7-25% increase from 2024’s 28.3 billion euros, according to the company’s presentation deck provided at the earnings call last week.

In the fourth quarter of 2024, the US was ASML’s largest market, accounting for 28% of sales, slightly surpassing China. This reflects TSMC’s expansion in Arizona and Intel’s purchase of two of ASML’s new USD 400 million high-NA EUV tools, as per Reuters.

Read more

• [News] ASML Reassures Long-Term Momentum, Projecting 8-14% Annual Revenue Growth through 2030
• [News] ASML CEO Christophe Fouquet: U.S. EUV Export Ban Causes China’s Chip-Making to Lag by 10-15 Years

(Photo credit: ASML)