[News] TSMC Fast-Tracking 3nm Progress in U.S., Equipment Installation Reportedly Starting Mid-2026

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Ahead of TSMC’s upcoming board meeting in the U.S., there are speculations that the company may speed up or expand investments due to potential tariffs on Taiwanese semiconductors. Industry sources cited by MoneyDJ suggest that TSMC’s second Arizona fab, featuring 3nm, will likely progress ahead of schedule, providing an ideal temporary response to U.S. pressures.

According to the report, TSMC’s second Arizona fab is expected to begin equipment installation in mid-2026, with mass production expected by 2027 to meet local demand.

Notably, this progress would exceed TSMC’s projections on its website, which expect the second plant to start 3nm and 2nm production in 2028, with a third plant potentially featuring 2nm and A16 by the late 2030s.

The MoneyDJ report further notes that initially, TSMC’s second Arizona plant will offer 25K–30K 3nm wafers per month. TSMC’s first Arizona plant, initially slated for 2025, started 4nm production ahead of schedule in Q4 2024.

At TSMC’s upcoming board meeting, key topics will include the Q4 2024 financial report, dividends, capital expenditures, and executive changes.

According to the Economic Daily News and Commercial Times, the market also speculates that TSMC might confirm plans for mass production at its third Arizona fab, possibly launch a fourth fab, or even build its first advanced packaging plant. Analysts cited by Commercial Times suggest TSMC may add advanced packaging capacity in Texas, filling a critical gap in the chip manufacturing process.

Read more

• [News] TSMC’s U.S. Board Meeting Focus at a Glance: Potential Expansion Amid Chip Export Restrictions

(Photo credit: TSMC)