[News] TSMC Reportedly Advancing Groundbreaking for Third Arizona Fab to June

U.S. President Donald Trump has accused Taiwan of taking away America’s semiconductor business, putting the spotlight on how TSMC will respond. According to a report by Taiwan’s Central News Agency (CNA), market sources indicate that TSMC may accelerate its plans for a third fab in Arizona, with groundbreaking expected in June alongside an official ceremony. TSMC stated that the project is progressing as planned.

Trump has proposed to impose tariffs on Taiwanese semiconductors, drawing widespread attention. Speculation about TSMC’s next moves includes ramping up advanced manufacturing in the U.S., expanding investments, or even taking a stake in or acquiring Intel’s wafer fabrication facilities.

CNA reports that market sources suggest TSMC’s third Arizona fab could break ground earlier than expected in June, with U.S. officials invited to the ceremony—underscoring the company’s commitment to expanding its American footprint.

TSMC declined to comment on market speculation but reiterated that its Arizona facility is progressing on schedule and that any public events would be announced accordingly.

TSMC’s first Arizona fab has begun mass production of 4nm chips in 4Q24, while the second fab is expected to be operational by 2028, utilizing more advanced nodes such as 3nm, 2nm, and A16 based on customer demand.

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(Photo credit: TSMC)