[News] Intel Principal Engineer Calls TSMC Deal Mistake, Argues 18A More Advanced with Early Adopters Secured

As Trump pushes tariffs to boost U.S. chipmaking, rumors of a TSMC-Intel deal intensify. Intel’s Principal Engineering Program Manager, Joseph Bonetti, called the move a “horrible, demoralizing mistake” in a now-deleted LinkedIn post, arguing that Intel 18A will be more advanced, as per Tom’s Hardware.

Bonetti emphasized Intel’s progress in semiconductor manufacturing, noting that 18A, set for Panther Lake processors, is nearing completion. In the post, he also stated that Intel Foundry is set to prove itself with its own products, while both Microsoft and Amazon are reportedly early adopters of 18A.

The progress echoes with what Co-CEO Michelle Johnston Holthaus said in early January, as she confirmed that Panther Lake, the first to utilize the Intel 18A process node, will debut in the second half of 2025. A sample was showcased at CES 2025 and is now in testing, as per TechNews.

18A Leads the Race Despite Challenges Ahead

Bonetti also addressed concerns that Intel’s 18A might be outperformed by TSMC’s N2. In the post, he claimed that though both nodes feature gate-all-around (GAA) transistors, Intel’s 18A has the added advantage of backside power delivery.

Intel’s 18A may also be leading in its production timetable, According to Bonetti, neither company has a “2nm” node at this point. Intel is on track to have theirs in production sooner, he added.

However, he also recognized Intel’s challenges ahead, noting that Intel Foundry is unprofitable due to heavy investments and a lack of major external contracts.

According to TSMC’s roadmap, its 2nm (N2) process is on track for mass production in the second half of 2025, with large-scale production planned for 2026.

Intel’s press release in 2023 noted that PowerVia, initially expected with the 20A node in 2024, will be the first backside power implementation in silicon, solving long-standing interconnect bottlenecks.

Solid Progress in the Angstrom Era with High-NA EUVs

How about the nodes beyond 18A? Bonetti stated that future nodes likely need ASML’s high-NA EUV tools, and Intel is set for at least a one-year head start, having secured ASML’s full capacity for high NA tools in 2024.

According to Dutch media outlet tweakers, the first modules of ASML’s TwinScan EXE:5200 will be delivered to a customer in the coming months, as another BITS&CHIPS report notes that Intel would be the first to receive the unit for its 14A node, while TSMC may begin high-NA mass production in 2028.

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(Photo credit: Intel)