[News] Nikon Aims to Close the Gap on ASML with New ArF Lithography System in FY28

As the semiconductor industry enters the Angstrom era, advanced node investments are increasingly dominated by tech giants. However, Japan’s Nikon aims to challenge this monopoly, planning to launch a new ArF immersion lithography system in FY2028 with improved compatibility with ASML’s products, according to Nikkan Kogyo Shimbun and BITS&CHIPS.

According to the reports, ASML dominates the market with a share of roughly 90%. Citing Nikon’s data, BITS&CHIPS reveals that in FY24 (ending March 2024), Nikon sold 11 ArF systems, but none in the first three quarters of FY25. Fewer than 100 advanced optical lithography tools are sold globally each year, as highlighted in the reports.

But the tide may be turning. According to Nikkan Kogyo Shimbun, Nikon is co-developing the system with semiconductor firms and plans to deliver a prototype in FY28. The new system will support ASML photomasks for easier customer transitions, with next-gen models planned after 2030, the report adds.

Notably, Nikon expects advancements in 3D DRAM and logic chips and aims to regain market share with its new system. BITS&CHIPS, citing Nikon’s data, indicates that the ArF market is projected to grow 40-50% over the next decade, driven by increased demand for 3D integration in logic and memory manufacturing.

Interestingly, Nikon isn’t the only Japanese electronics company reinventing itself as a semiconductor firm. In September 2024, Canon unveiled its FPA-1200NZ2C nanoimprint lithography (NIL) system, which uses a unique approach to create circuit patterns, unlike traditional projection exposure technology.

According to Nikkei, Canon’s NIL lithography equipment, with reduced power consumption and cost, enables patterning with a minimum linewidth of 14 nm, matching the 5 nm node used for advanced logic semiconductors. With further improvements, it’s expected to also produce 2 nm chips, the report notes.

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(Photo credit: Nikon)