[News] Intel Claims High-NA EUV Machines in Production with Good Results, But 18A Yield Concerns Loom

Shortly after confirming positive progress on its 18A node, with tape-outs set for 1H25, Intel also updated on its adoption of high-NA EUV equipment. On Monday, the company revealed that the first two high-NA EUV machines from ASML are in production, processing 30,000 wafers in a quarter already, as per Reuters.

Citing Team Blue’s senior engineer Steve Carson, the report notes that ASML’s high-NA machines are twice as reliable as the previous generation in early tests. They also cut processing from three exposures and 40 steps to just one exposure and a single-digit number of steps, saving time and cost, as highlighted by Reuters.

According to Reuters, Intel plans to use high-NA machines for developing its 18A process. In addition, Intel aims to fully deploy these machines for its next-gen 14A technology but hasn’t announced a production timeline yet, the report adds.

Despite plans to reduce its 2025 capex to $20 billion from $24 billion in 2024, the struggling giant is focused on accelerating next-gen node development with ASML’s latest equipment. According to Dutch media outlet tweakers, the first modules of ASML’s TwinScan EXE:5200 will be delivered to a customer in the coming months.

BITS&CHIPS suggests that Intel would be the first to receive the EXE:5200 for its 14A node, while TSMC may begin high-NA mass production in 2028, the report adds.

On the other hand, while adopting cutting-edge semiconductor equipment may kickstart advanced chip production, it doesn’t guarantee success. Despite Intel claiming 18A readiness with planned tape-outs in 1H25, a Wccftech report raises concerns about its integration into mainstream products. Industry surveys cited by the report suggest a yield rate of only 20%-30%, making mass production nearly impossible for now.

Read more

• [News] ASML to Ship First Second-Gen High-NA EUV Machine in the Coming Months, Aiming for 2026 Production
• [News] Intel to Begin 18A Tape-outs in 1H25, Reportedly Leading TSMC’s 2nm Launch

(Photo credit: ASML)