[News] Innolux Leads FOPLP Race with Industry’s Largest Substrate, Mass Production Reportedly Set in 1H25

As CoWoS capacity tightens amid soaring AI-driven demand, semiconductor giants are turning to fan-out panel-level packaging (FOPLP), as square substrates allow for significantly more chips per panel. According to the Economic Daily News, Taiwanese panel maker Innolux aims to begin FOPLP mass production in the first half of 2025, outpacing rivals like TSMC and ASE.

The report reveals that Innolux is developing a 700mm x 700mm FOPLP substrate, set to be the industry’s largest.

Meanwhile, MoneyDJ reports that Taiwan’s leading OSAT firm ASE has invested $200 million in large-size FOPLP technology, expanding substrate sizes from 300mm x 300mm to 600mm x 600mm. According to the Economic Daily News, equipment is set to arrive in Q2, with trial production expected in Q3.

On the other hand, TSMC Chairman C.C. Wei confirmed in 2024 that the foundry giant has been working on a mini FOPLP production line, with achievements expected within three years.

As per MoneyDJ, TSMC prefers the 300x300mm size instead of the rumored 515x510mm, with the mini line expected to be set up by 2026 at the earliest and ramping up gradually in 2027.

Industry sources cited by the Economic Daily News note that the current CoWoS packaging technology leverages round substrates, which limits chip placement as sizes grow. In contrast, rectangular substrates used in FOPLP could fit more chips per panel, boosting utilization and cutting costs.

Read more

• [News] Packaging and Equipment Firms Accelerate FOPLP Deployment: Spotlight on 7 Taiwanese Companies
• [News] TSMC Rumored to Begin FOPLP Production with Smaller Substrates, with Mini Lines Prepared by 2026

(Photo credit: Innolux)