[News] Samsung Reportedly Develops Glass Interposers for Packaging, Leveraging Corning’s Glass

According to a report from Business Korea, citing SEDaily, Samsung Electronics’ Device Solutions (DS) division has begun developing “glass interposers,” a next-generation packaging material. The goal is not only to replace the expensive silicon interposers but also to enhance performance.

Meanwhile, as noted by the report, Samsung Electro-Mechanics is working on developing “glass substrates,” setting the stage for an internal competition within the Samsung Group to improve semiconductor productivity.

Samsung Electronics’ Plans for Glass Interposer Development

As indicated by SEDaily, citing industry sources on the 6th, Samsung Electronics recently received a collaborative proposal from Chemtronics, a materials supplier, and Philoptics, an equipment manufacturer, for the development of glass interposers. Samsung Electronics is reportedly exploring the use of Corning’s glass and may assign the production of glass interposers to these companies.

An interposer is a material that enables efficient connectivity between semiconductor substrates and chips, as highlighted in the report.

Samsung Electro-Mechanics’ Glass Substrate Development

Samsung Electro-Mechanics is actively working on developing glass substrates, with the goal of achieving mass production by 2027, as the report indicates. The report highlights that glass substrates can significantly reduce warping, an issue that arises as plastic substrates expand in size.

Citing industry sources, the report notes that Samsung Electro-Mechanics aims to establish itself in the glass substrate supply chain for major tech firms, while Samsung Electronics views glass interposer development as a strategic move to enhance its semiconductor packaging capabilities.

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(Photo credit: Samsung Electro-Mechanics)