[News] MediaTek Set to Launch Dimensity 9400+ 5G AI Chipset, First Devices Reportedly Arriving in April

MediaTek has officially set its Dimensity Developer Conference (MDDC 2025) for April 11 in Shenzhen, China. Reports from Sina and IT Home suggest the company will unveil its latest flagship 5G AI chipset, Dimensity 9400+.

The Sina Hong Kong report indicates that the first devices powered by this chip are expected to launch in April, including the Oppo Find X8S and vivo X200S.

MyDrivers notes that AI was already a major highlight at MDDC 2024, when MediaTek introduced the Dimensity 9300+ flagship chipset, featuring an all-big-core design and on-device AI speculative decoding. This enabled the Llama 2 7B model to run at 22 tokens per second, laying the hardware foundation for generative AI smartphones, the report adds.

MediaTek has made significant strides in China’s smartphone market. According to the Economic Daily News, citing MediaTek President Joe Chen, the company’s share in the flagship smartphone chipset segment has been on a steady rise in China.

Its market share in China climbed from just over 30% in 2023 to around 40% in 2024, with further gains anticipated in 2025, as highlighted in the Economic Daily News report.

MediaTek’s latest flagship mobile processor, Dimensity 9500, is also gaining stronger adoption among clients than Dimensity 9400, according to the Economic Daily News report. The chipset is said to be built on TSMC’s 3nm node.

Read more

• [News] NVIDIA Unveils Personal AI Computers with MediaTek Co-Developed Chip at CES; Secures Toyota Deal
• [News] MediaTek’s Dimensity 9500 Might Use TSMC’s N3P instead of 2nm, Giving Samsung an Advantage

(Photo credit: MediaTek)