[News] SK hynix Reportedly Locks in Exclusive 12H HBM3E Deal for NVIDIA’s GB300

With NVIDIA unveiling its next-gen GB300 AI chip at GTC 2025, SK hynix stands to benefit as the exclusive supplier of 12H HBM3E for the Blackwell Ultra, according to South Korean media outlet Business Post.

In addition, SK hynix could further strengthen its HBM lead, as the report suggests its HBM4 will power NVIDIA’s next-gen AI chip, Rubin, set for a Q3 launch.

Notably, while earlier reports suggested that Micron completed its 12-stack HBM development in September 2024 and showcased samples to NVIDIA and other potential customers, Business Post indicates the company has failed to secure initial supply orders from NVIDIA.

Meanwhile, while Samsung has reportedly received positive feedback from NVIDIA, it is expected to secure qualification for its 8-layer and 12-layer products no earlier than late May or early June, according to Alpha Economy.

Considering that SK hynix began mass production of HBM3E 8-layer in March, 2024, and started producing HBM3E 12-layer in September, Samsung is expected to need at least six more months to fully ramp up its HBM3E production, as noted by Business Post.

As per Wccftech, GB300 will be the highlight of NVIDIA’s GTC 2025, featuring a logic structure similar to the B200 but with 288GB of HBM, leveraging HBM3E 12-high stacking technology.

On the other hand, NVIDIA’s Rubin is slated for production in 2026, and will reportedly feature eight HBM4 stacks totaling 384GB, according to Wccftech.

Read more

• [News] SK hynix Gears up for 16H HBM3E Mass Production in 2025, with Early Testing Showing Positive Results
• [News] Micron Reportedly Set to Mass Produce 12-Stack HBM3E, Securing NVIDIA Supply Deal

(Photo credit: SK hynix)