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[News] Apple’s A20 Chip May Stick to TSMC’s N3P Process, Delaying 2nm Adoption but Featuring CoWoS Packaging


2025-03-19 Semiconductors editor

In December 2024, industry sources indicated that TSMC’s 2nm trial production yield had exceeded 60%, sparking speculation about its first adopters. However, according to Wccftech, Apple—a major TSMC customer known for consistently seeking a competitive edge through advanced manufacturing processes—may instead choose to stick with TSMC’s 3nm N3P process for the A20 chip, which is expected to debut in late 2026 alongside the iPhone 18 series.

MacRumors report suggests that if this information proves correct, the A21 chip would be the first iPhone processor to utilize TSMC’s 2nm technology, with its earliest possible debut in 2027. The report from Wccftech indicates that Apple could delay transition to a more advanced node due to cost considerations.

Apple’s A20 Might Adopt TSMC’s CoWoS Packaging

Apple is set to launch its A19 and A19 Pro chips for the iPhone 17 series in late 2025, with both slated for mass production using TSMC’s third-generation 3nm process, as noted by Wccftech. The report highlights that the only significant difference between the A19, A19 Pro, and the A20 is that the A20 could leverage a newer packaging technology to gain an advantage.

According to an analyst cited in the MacRumors report, the A20 is anticipated to adopt TSMC’s Chip on Wafer on Substrate (CoWoS) packaging technology, enabling closer integration of various parts, achieving better performance and efficiency.

In addition to CoWoS, Wccftech notes that Apple is also assessing TSMC’s SoIC-MH packaging, or Small Outline Integrated Circuit Molding-Horizontal, for its high-end M5 SoC. As indicated by the report, Apple might prioritize advanced packaging techniques over an immediate transition to newer manufacturing nodes.

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(Photo credit: Apple)

Please note that this article cites information from Wccftech and MacRumors.

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