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[News] SK hynix Delivers World’s First 12-Layer HBM4 Samples, Gearing up for Mass Production in 2H25


2025-03-19 Semiconductors editor

With SK hynix reportedly securing exclusive 12H HBM3E supply to NVIDIA’s GB300 AI chip, the South Korean memory giant has now come up with more good news. According to its press release, the company has shipped the world’s first 12-layer HBM4 samples to major customers.

Leveraging its HBM expertise, SK hynix delivered ahead of schedule and is now starting customer certification, as per the company. Notably, SK hynix reveals that mass production prep is set for the second half of 2025.

A previous report from Business Post noted that while SK hynix stands to benefit as the exclusive supplier of 12-layer HBM3E for the Blackwell Ultra, its HBM4 will power NVIDIA’s next-gen AI chip, Rubin, set for a Q3 launch. The latest announcement by the company aligns with this roadmap.

According to SK hynix, the 12-layer HBM4 samples boast the industry’s highest capacity and speed. For the first time, it delivers over 2TB/s bandwidth, processing 400+ full-HD movies (5GB each) per second—60% faster than HBM3E.

In addition, SK hynix used the Advanced MR-MUF process to achieve 36GB capacity, the highest among 12-layer HBM products. This proven technology prevents chip warpage and enhances heat dissipation for better stability, as per SK hynix.

Updates on Micron and Samsung

The advancement extends SK hynix’s competitive edge in the HBM race. According to Business Post, Micron completed its 12-stack HBM3E development in September 2024 but has yet to secure initial supply orders from NVIDIA.

Meanwhile, while Samsung has reportedly received positive feedback from NVIDIA, it is expected to secure qualification for its 8-layer and 12-layer HBM3E products no earlier than late May or early June, according to Alpha Economy.

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(Photo credit: SK hynix)

Please note that this article cites information from SK hynix, Business Post and Alpha Economy.

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