[News] SK hynix Reportedly Fast-Tracks M15X Fab Setup as Broadcom’s HBM Orders Surge

According to TechNews, citing TheElec, SK hynix plans to introduce equipment at its new M15X fab two months earlier than scheduled due to a surge in HBM orders. Originally set for December, the equipment delivery has now been moved up to October. The report suggests this acceleration may be linked to a large HBM order from Broadcom.

The report further highlights that SK hynix plans to begin HBM production for Broadcom in the third quarter. Sources indicate that by the end of 2025, Broadcom is expected to account for 30% of SK hynix’s total HBM production capacity.

Last year, SK hynix announced plans to invest 20 trillion KRW in constructing the M15X fab at its Cheongju facility. The new fab is expected to produce 1b DRAM, the core die for SK hynix’s HBM3E.

The report also points out that SK hynix is considering expanding the capacity of the M15X fab beyond its initial plan. Originally set at 32,000 wafers per month, the capacity may nearly double, though the final target is expected to be determined next month.

Simultaneously, SK hynix is ramping up 1b DRAM production at its existing fabs. According to the report, this expansion will bring the company’s monthly capacity to 178,000 wafers by the end of 2025.

Looking ahead, the report indicates that SK hynix is anticipated to achieve a total monthly capacity of 240,000 wafers once the M15X fab becomes fully operational by the end of 2026.

Building on its expertise in HBM, SK hynix announced on March 19th that it has shipped the world’s first 12-layer HBM4 samples to major customers, targeting NVIDIA’s next-generation flagship product, Rubin.

Meanwhile, as NVIDIA unveiled its next-generation GB300 AI chip at GTC 2025, SK hynix has reportedly secured a 12-layer HBM3E contract for the chip. However, according to Yonhap News and Munhwa News, NVIDIA CEO Jensen Huang expressed optimism that Samsung’s HBM3E could also be used in Blackwell Ultra, highlighting the intensifying competition in the HBM market.

Read more

• [News] NVIDIA’s Jensen Huang: Samsung’s HBM3E Likely to Power Blackwell Ultra
• [News] SK hynix Delivers World’s First 12-Layer HBM4 Samples, Gearing up for Mass Production in 2H25

(Photo credit: SK hynix)