[News] Samsung Reportedly Gears Up for HBM3E 8H Supply to Broadcom

With NVIDIA CEO Jensen Huang optimistic about Samsung’s HBM3E for Blackwell Ultra, the Korean memory giant appears to be making strides with other big techs as well. According to Sedaily, Samsung is likely to supply its 8-layer HBM3E to Broadcom soon.

Sources cited by the report say Samsung recently performed well in Broadcom’s HBM3E 8-layer qualification test, meeting speed requirements and moving closer to its supply chain.

This would mark a major milestone for Samsung, as the report notes that while it has long supplied HBM products to Broadcom, the U.S. chip leader changed its mind and first approved SK hynix’s HBM3E.

Prior to this, an Alpha Economy report suggested that Samsung is likely to secure qualification from NVIDIA between late May and early June. The company has recently earned high marks in the post-processing review of its redesigned HBM, as per the report.

Beyond these tech giants, Samsung is gaining attention from other major players with its latest HBM. Sedaily reports it recently underwent an HBM review with AMD, while Amazon is also showing strong interest.

However, with SK hynix and Micron securing 12-layer HBM3E slots in NVIDIA’s GB300, Samsung still has ground to cover. Micron has confirmed that its HBM3E 8H is designed into NVIDIA’s GB200 system and its HBM3E 12H in the GB300.

Meanwhile, SK hynix states in its press release that the company has shipped the world’s first 12-layer HBM4 samples to major customers, with mass production expected in the second half of 2025.

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• [News] Samsung Reportedly Scores High in Review, with NVIDIA’s HBM3E Qualification Likely by Early June

(Photo credit: Samsung)