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[News] TSMC Gears Up for SoIC, Reportedly Secures Orders from NVIDIA’s Rubin After AMD and Apple
As TSMC preps for 2nm mass production in the second half of 2025, it is also accelerating advanced packaging expansion to meet strong demand, with a shifting focus beyond CoWoS. According to Commercial Times, NVIDIA’s next-gen Rubin GPU will join AMD and Apple in adopting TSMC’s SoIC (System on Integrated Chips) technology.
TSMC sees SoIC as a key to integrating heterogeneous chiplets, reducing size, and boosting performance. According to TSMC, by leveraging SoIC, chiplets could be made with tailored, optimized technologies, then tightly combined into a new chip for better efficiency and cost-effectiveness.
The report suggests that Rubin will be NVIDIA’s first chiplet-based GPU. As per Commercial Times, the GPU itself will use TSMC’s N3P process, while the I/O die will be made with N5B. SoIC packaging will then reportedly integrate two GPUs with a single I/O die.
Prior to Rubin, supply chain sources cited by the report indicate that NVIDIA’s archrival, AMD, would be the first to adopt SoIC, with Apple set to follow in the second half of 2025, integrating the technology into its M5 chip.
With robust customer demand, TSMC is also speeding up its advanced packaging facility expansion, with both AP8 in Southern Taiwan (acquired from Innolux) and AP7 in Chiayi set to launch in the second half of 2025, the report adds.
Equipment suppliers told Commercial Times that tools will begin installation at AP8, the newly added plant in Southern Taiwan in the second quarter, followed by AP7, the Chiayi facility by the end of the third quarter. However, CoWoS will still be the main focus for equipment deliveries, with CoWoS-L making up the majority, the report notes.
On the manpower front, TSMC is actively recruiting local operators while also reallocating personnel from its 8-inch fabs to support operations, as indicated by the report.
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(Photo credit: TSMC)
