News
According to a TechNews report citing Nikkei, Japanese food and biotech company Ajinomoto plans to invest at least JPY 25 billion (approximately USD 166 million) by 2030 to boost production capacity of Ajinomoto Build-up Film (ABF)—a key material used in semiconductor substrates—by 50%.
As the report explains, ABF is an insulating film developed by Ajinomoto leveraging its expertise in fine chemicals. It is specifically engineered to meet the demanding requirements of the semiconductor industry, offering high durability and low thermal expansion—essential qualities for advanced chip packaging.
The report points out that Ajinomoto holds more than 95% of the global market share for ABF materials used in GPU and CPU substrates, reinforcing its dominant position in this specialized sector.
The company has already spent JPY 25 billion over two years through the current fiscal year to expand its production, as indicated by the report from Nikkei.
Ajinomoto’s functional materials segment—which includes ABF—accounted for 20% of the company’s total business profit in the fiscal year ending March 2024. As noted in the report, the company expects profit from this segment to rise by 35% in the current fiscal year, reaching JPY 37.2 billion. Furthermore, as highlighted by Nikkei, the company expects sales of this segment to grow at an annual rate exceeding 10% through 2030.
Read more
(Photo credit: Ajinomoto)
