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According to a report from The Economic Times, Indian company Kaynes Semicon is set to deliver the country’s first packaged semiconductor chip in July 2025.
As the report highlights, Kaynes CEO Raghu Panicker has confirmed the timeline. It also states that the pilot line is “almost” complete, with machinery and cleanroom facilities scheduled to go into operation in May
Qualification testing is scheduled for June, with the first chip samples to be sent to U.S. semiconductor company Alpha Omega Semiconductor in July. The initial phase of the collaboration is expected to utilize 60% of the plant’s production capacity, as the report notes.
Kaynes received government approval in September last year to establish an outsourced semiconductor assembly and test (OSAT) facility in Sanand, Gujarat, with an investment of INR 33.07 billion, as indicated by the report. The facility is designed to produce up to 6.3 million chips per day.
The report highlights that Kaynes’ project is one of four that have received approval from the Indian government to establish chip assembly plants. The other approved firms are CG Power, Tata Electronics, and Micron. The report also notes that Tata Electronics is building India’s first wafer fabrication facility.
However, as noted by another report from The Economic Times, Micron’s chip packaging and testing plant in Sanand, originally scheduled to be operational in 2024, has now been delayed to early 2025.
Meanwhile, India has been attracting investments from global tech giants. A Reuters report from February states that U.S.-based semiconductor equipment maker Lam Research has announced plans to invest over INR 100 billion (approximately USD 1.2 billion) in the southern state of Karnataka in India over the next few years.
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(Photo credit: Kaynes Semicon)
