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Driven by both policy and market demand, a wave of mergers and acquisitions is sweeping through China’s semiconductor industry, with equipment manufacturers actively participating. Following NAURA’s announcement of acquiring shares in KINGSEMI, another major development has emerged—HWATSING has completed its acquisition of Xinyu Semiconductor, accelerating its expansion into the high-end semiconductor equipment sector.
Meanwhile, in response to complex international conditions, the importance of independent control over semiconductor equipment continues to grow. Beyond M&A activities, Chinese manufacturers are also enhancing their technological capabilities by launching representative products, accelerating breakthroughs and market expansion.
HWATSING Completes Acquisition of Xinyu Semiconductor, Targeting Ion Implantation Equipment Market
On April 1, HWATSING announced that it had completed the acquisition of the remaining 82% equity of Xinyu Semiconductor. As a result, the company and its wholly-owned subsidiary, HWATSING (Shanghai) Semiconductor Co., Ltd., now hold 100% ownership of Xinyu Semiconductor, making it a wholly-owned subsidiary of HWATSING. HWATSING Shanghai holds 78.6667% of Xinyu Semiconductor, while HWATSING Co., Ltd. holds the remaining 21.3333%, together constituting full ownership.
HWATSING and its subsidiary HWATSING Shanghai utilized self-owned funds amounting to no more than RMB 1.0045 billion to complete this transaction. Xinyu Semiconductor has completed all necessary business registration modifications and obtained an updated business license from the Market Supervision Administration of the China (Shanghai) Pilot Free Trade Zone.
HWATSING stated that this acquisition is a key move to implement its “Equipment + Service” platform development strategy, expand its product portfolio, and accelerate its layout in the integrated circuit ion implantation equipment sector.
According to public records, HWATSING is a high-end semiconductor equipment manufacturer in China, specializing in the research, development, production, sales, and technical services of semiconductor-specific equipment.
Its main products include CMP equipment, high-current ion implantation machines, thinning and polishing integrated machines, edge trimming machines, edge polishing machines, and wafer cleaning machines.
Xinyu Semiconductor has a registered capital of RMB 15.789474 million and operates in the specialized semiconductor equipment manufacturing and electronic equipment manufacturing sectors. Its core product is low-energy, high-current ion implantation equipment, primarily used in integrated circuit manufacturing.
NAURA Acquires an Additional 8.41% Stake in KINGSEMI, Poised to Become the Largest Shareholder
Recently, NAURA and KINGSEMI simultaneously released announcements. According to KINGSEMI’s disclosure, Shenyang Zhongke Tiansheng Automation Technology Co., Ltd. (referred to as “Zhongke Tiansheng”), a shareholder holding more than 5% of the company’s shares, has agreed to transfer 16.9 million shares, representing 8.41% of the total share capital, through a public solicitation.
In addition to bidding for these shares, NAURA signed a share transfer agreement on March 10 with Shenyang Advanced Manufacturing Technology Industry Co., Ltd. (referred to as “Advanced Manufacturing”). NAURA intends to acquire a 9.49% stake in KINGSEMI, amounting to 19.0649 million shares, at a price of RMB 88.48 per share, with a total transaction amount of RMB 1.687 billion. This agreement is still in progress. KINGSEMI stated that if both agreements are successfully completed, NAURA’s total shareholding will reach 17.9%, making it the company’s largest shareholder.
KINGSEMI specializes in semiconductor production equipment R&D and is a leading high-end semiconductor equipment manufacturer in China. Its product line includes coating machines, developing machines, spin coaters, stripping machines, wet etching machines, and single-wafer cleaning machines.
New Semiconductor Equipment Products Showcase Strength of Chinese Manufacturers
At the recently concluded SEMICON China 2025 exhibition, Chinese semiconductor equipment manufacturers unveiled numerous new products, demonstrating their growing technological capabilities and attracting significant attention.
NAURA introduced its first ion implantation machine, the Sirius MC 313, officially entering the ion implantation equipment market. Additionally, it launched the Ausip T830, its first 12-inch electroplating (ECP) equipment designed for silicon through-hole (TSV) copper filling applications, primarily used in 2.5D/3D advanced packaging.
HWATSING showcased its full range of advanced semiconductor equipment and process integration solutions. Among them, the Universal-H300 features an innovative polishing system architecture, combining advanced polishing processes, high efficiency, and high stability in a 12-inch CMP system.
Meanwhile, the iPUMA-LE high-current ion implantation machine integrates advanced beam climbing technology with magnetic and electric field modules and is equipped with precision measurement technology, offering excellent ion selection capabilities and accuracy.
AMEC unveiled its self-developed 12-inch wafer edge etching equipment, Primo Halona™, marking another breakthrough in plasma etching technology.
Piotech introduced new products in its ALD series, 3D-IC and advanced packaging series, and CVD series.
DJEL launched its latest-generation DR-SEM r655, featuring a new high-performance electron gun and optical inspection module.
Chinese semiconductor equipment manufacturers continue to enhance their technological capabilities and introduce new products.
This not only reflects the strong growth trend driven by demand in the equipment market but also highlights Chinese companies’ ability to adapt, strengthen technological innovation, and gradually overcome industry challenges in the face of intense global semiconductor competition. The future outlook remains promising.
(Photo credit: HWATSING)
