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As the HBM race heats up among memory giants, TC (thermal compression) bonders are taking center stage. Notably, recent developments involving key player Hanmi Semiconductor, Micron, and SK hynix have sparked attention—and could potentially reshape the memory landscape, according to reports from The Elec and DealSite.
TC bonders, which stack chips onto processed wafers by employing thermal compression to bond, play a crucial role in HBM yields. According to Pulse, this high-end equipment is no easy feat to make, as it demands fine alignment accuracy and advanced thermal control, creating significant barriers to entry.
As per The Elec, Hanmi Semiconductor has reportedly landed a major order from Micron for around 50 TC bonders lately, which would be significantly larger than the dozens of units shipped to the U.S. memory maker in 2024.
Micron is even mulling to double down on Hanmi, with another order of 20 to 30 TC bonders expected in the second half of this year, the report adds.
Tensions Escalate as Price Hike Reportedly Looms
However, Hanmi’s closer alignment with Micron and rumored price hikes for SK hynix point to growing tensions in their long-standing partnership. According to The Elec, Hanmi increased TC bonder prices for SK hynix by 25–28% and withdrew all engineers from its Icheon HBM line to focus more on Micron.
The DealSite report points out that Hanmi’s TC bonders could support both Samsung and Micron’s TC-NCF process as well as SK hynix’s MR (Molded Reflow) – MUF (Mold Underfill) method.
Notably, as per The Elec, Micron’s complex NCF (Non-Conductive Film) process—attaching film, aligning chips, and applying high pressure—drives up equipment costs, which could explain the price hike Hanmi proposed to SK hynix.
Turnaround Possible?
Hanmi Semiconductor’s move may be a strategy to prioritize highly profitable orders from Micron, according to The Elec. However, if SK hynix offers more orders and improved supply conditions, there’s still a chance for a dramatic turnaround, the report adds.
According to Pulse, since 2017, Hanmi has been the exclusive supplier of TC bonders to SK hynix. But tensions reportedly flared in March 2025 when SK hynix signed a supply deal with Hanwha Semitech for a dual-sourcing strategy. Hanmi reportedly pushed back, claiming Hanwha’s equipment infringes on its patented technologies, as per Pulse.
Following that, Hanmi made a bold move, demanding a price hike for its TC bonders from SK hynix, as noted by Pulse. It also started charging for maintenance services that were once free and began pulling its on-site staff, the report suggests.
Opportunity for Samsung?
It is worth noting that amid the tensions with SK hynix, the potential collaboration between Hanmi and Samsung seems to be brought back at the table recently, as per DealSite. The report indicates that while Hanmi’s relationship with Samsung soured after a 2011 patent dispute involving Samsung’s subsidiary SEMES, any lingering issues have been resolved.
Samsung, currently redesigning HBM3E to address yield issues, is considering the cooperation with Hanmi as one of its key improvement strategies, as per DealSite.
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(Photo credit: Hanmi Semiconductors)
