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As the HBM race heats up, TC (thermal compression) bonders, which stack chips onto processed wafers by employing thermal compression to bond, are in hot demand. Memory giants are scrambling to lock in orders, and according to Money Today, Hanmi Semiconductor is seeing a surge in overseas interest, especially from Micron and Chinese memory firms.
Hanmi Semiconductor dominates the TC bonder market for HBM3E, holding a commanding 90% share, as noted by the Chosun Daily.
Notably, the Money Today report suggests that in the first quarter of 2025, nearly 90% of Hanmi’s sales came from overseas, with U.S. memory giant Micron playing a key role. Micron is reportedly pouring most of its $14 billion capex this year into HBM production, packaging, R&D, and testing.
As per The Elec, Hanmi Semiconductor has reportedly landed a major order from Micron for around 50 TC bonders lately, which would be significantly larger than the dozens of units shipped to the U.S. memory maker in 2024.
According to Money Today, Micron broke ground on a packaging line in Singapore this January and is also gearing up HBM production facilities in Idaho (U.S.), Hiroshima (Japan), and Taiwan. The company aims to boost its single-digit HBM market share to match its DRAM share of 20–25%, the report adds.
China’s Emergence
It is worth noting that Chinese memory makers are also accelerating their HBM efforts, with mass production capabilities for HBM2 and HBM2e reportedly in place. As China scales up HBM2 production, TC bonder orders are reportedly on the rise, according to Money Today.
Meanwhile, another report from Business Post suggests that Chinese memory firms are reportedly setting sights on developing HBM3 by 2026, with plans to roll out next-gen HBM3E in 2027.
With SK hynix’s HBM production space nearing full capacity and new line expansion proving temporarily difficult, Hanmi may lean further into orders from Micron and other global clients, the report indicates.
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(Photo credit: Hanmi Semiconductor)
