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During the 2025 Shanghai Auto Show, Intel announced new partnerships with companies including Black Sesame Technologies, Model Best, and BOS Semiconductors, aiming to collaboratively cross technological hurdles in the automotive intelligence process and build an open, mutually beneficial smart vehicle ecosystem.
Black Sesame Technologies and Intel jointly launched an integrated cockpit-driving platform. This integrates Intel’s AI-enhanced SDV SoC with Black Sesame’s Huashan A2000 and Wudang C1200 series chips. With computing power far beyond single-chip solutions, the platform meets automakers’ demands from L2+ to L4 driving levels and the needs for enhancing interactive cockpit experiences. The two parties plan to release a reference design for the cockpit-driving platform in Q2 of 2025 and prepare for mass production.
Model Best and Intel have joined force to co-develop a natively intelligent in-vehicle cockpit at the edge. Together, they are pioneering the industry’s first pure-edge GUI-based in-car intelligent agent. By combining Intel’s computing and memory advantages with Model Best’s high-density knowledge edge-side large model’s inference efficiency and real-time responsiveness, such a purely edge-side GUI agent will support offline voice command comprehension, contextual memory, personalized service recommendations, and screen interaction. It will also handle complex dialogue scenarios with smooth language parsing and natural command understanding, enabling more fluid and intuitive human-machine interaction.
Intel and Korean semiconductor company BOS Semiconductors announced a collaboration to enhance AI performance in advanced driver-assistance systems (ADAS) and in-vehicle infotainment. With support from BOS’s automotive AI accelerator chiplet SoC “Eagle-N” and others, Intel’s AI-enhanced software-defined SoC will offer automakers more powerful AI solutions. Intel’s open hardware-software architecture makes this collaboration possible, providing automakers with greater flexibility and accelerating automotive intelligence.
Besides, Intel has also made progress with long-standing collaborators in advanced process foundry technologies. As per Tom’s Hardware, Intel has placed orders with TSMC for N2 process technology, with wafers likely to be used in Intel’s upcoming Nova Lake processor series.
Reportedly, the Nova Lake processors, successors to the current Arrow Lake line, may feature up to 52 hybrid cores (16P + 32E + 4LPE), divided into two zones. Each zone will include eight Coyote Cove performance cores and 16 Arctic Wolf efficiency cores, with four additional LPE cores possibly located in a separate SoC tile.
Back in November 2024, Intel announced a dual-sourcing strategy for Nova Lake—relying not only on its own manufacturing processes but also outsourcing to third-party partners like TSMC. This is not Intel’s first collaboration with TSMC on processor production. Its Arrow Lake, Lunar Lake, and the Alchemist and Battlemage have all utilized TSMC’s process technologies.
In March 2025, Lip-Bu Tan officially took over as Intel’s CEO. Following his appointment, he has pushed for a series of reforms focused on streamlining architecture, emphasizing core businesses, and reinforcing technology-driven strategies—aimed at reshaping Intel’s competitiveness and addressing market challenges.
In terms of core business focus, Intel is strengthening its foundry and AI chip efforts, planning mass production of the Intel 18A process, advancing custom x86 chip development, and prioritizing AI and high-performance computing. Industry insiders believe that despite short-term challenges, these reforms hold promise for Intel to achieve breakthroughs in AI and semiconductor manufacturing over the long term.
(Photo credit: Intel)
