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At TSMC’s North America Technology Symposium, the foundry giant rolled out an ambitious roadmap for its CoWoS technology. Meanwhile, major customer NVIDIA is showing signs of strong momentum too. According to Commercial Times, NVIDIA’s production schedule for its B300 series has reportedly been moved up to May, using TSMC’s 5nm process and CoWoS-L advanced packaging.
As highlighted by Wccftech, for the GB300 Blackwell Ultra, NVIDIA has decided to switch from the Cordelia compute board structure, which features 2 CPUs and 4 GPUs, to the Bianca architecture used by GB200, which pairs 1 CPU with 2 GPUs.
According to Commercial Times, the move could help NVIDIA accelerate the B300 series timeline and achieve mass production by the end of the year, benefiting TSMC and other key Taiwanese assemblers like Quanta, Wistron, and Foxconn.
Notably, despite worries about slowing CoWoS demand, the report notes that TSMC’s new advanced packaging site, AP8 in Southern Taiwan, started moving in equipment this April to support B300 production. Sources also confirm that customer pull-ins remain strong, particularly for CoWoS-L, the report adds.
With the U.S. announcing news export curbs on NVIDIA’s H20 in China, sources cited by Commercial Times note that the B300—also based on 5nm—will step in to fill the gap.
However, whether NVIDIA’s latest B300 AI chip could be American made remains unclear since the TSMC’s Arizona fab in the U.S. still lacks CoWoS-L packaging capacity. The report notes that even NVIDIA’s chips could be fabricated there, they would need to be sent back to Taiwan for backend manufacturing.
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(Photo credit: NVIDIA)
