[Insights] Memory Spot Price Update: DRAM Remains Weak Despite Samsung’s Capacity Shift to HBM

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According to TrendForce’s latest memory spot price trend report, the spot price of DRAM remains weak, as Samsung’s reallocation of its D1A process to the manufacturing of HBM products did little help. As for NAND flash, overall transactions are also sitting on the enervated end due to weakening market demand. Details are as follows:

DRAM Spot Price:

A fire-related incident occurred at Micron’s fab in Taichung on June 20th, but no actual losses (in bit terms) have been reported. In response to this event, module houses did temporarily suspend quoting, but they soon resumed trading activities. Overall, the event has had no positive effect on the spot price trend, which remains relatively weak. Similar to last week, spot trading has been fairly tepid, and prices of DDR4 products have fallen more significantly compared to DDR5 products. With Samsung reallocating its D1A process to the manufacturing of HBM products, spot prices of DDR5 products have actually experienced sporadic hikes for a while. Mainstream die DDR4 1Gx8 2666 MT/s saw a price increase of 1.36% this week (US$1.835 to US$1.860).

NAND Flash Spot Price:

Module houses have started adopting even more aggressive pricing strategies to effectively control their inventory, though overall transactions are sitting on the enervated end due to weakening market demand. TrendForce believes that inventory pressure would continue to bring down spot prices, which dropped to US$3.302 for 512Gb TLC wafers this week at a 0.21% reduction.